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Slitting, Surface Treatment, and Thermal Lamination for Electronic Materials [Kawamura Sangyo]

[Presentation of 4 Technical Introduction Materials] We respond from prototyping to mass production! We also support material procurement. We accommodate electronic materials that require high functionality, such as those for 5G products.

At Kawamura Industries, we create and provide electronic materials with various functions by integrating processes such as slitting, plasma surface treatment, sputtering, and thermal lamination. We can handle everything from prototyping to mass production, including material procurement. We welcome inquiries for small lot requests as well. 【Our Technologies】 ■ Slitting With about 50 years of extensive experience, we can accommodate slit widths from 2mm to 2,000mm. We can process in clean rooms as well as in yellow rooms. ■ Plasma Surface Treatment Effective for improving the adhesion of low-adhesion films like fluorine films. Our roll-to-roll equipment allows for rapid mass production startup. ■ Thermal Lamination We have a vacuum thermal press capable of handling high temperatures up to 400°C within a clean room. Our laminating machines can also operate in a clean environment from the preparation stage. ■ Sputtering We possess roll-to-roll equipment. In collaboration with partner companies, we can also perform electrolytic copper plating on sputtered materials using roll-to-roll methods. *You can view technical documents and introductory materials regarding the above processing technologies from the <PDF Download>. Please feel free to contact us with any inquiries.